
第三架马车:激光辅助键和技术(laser assisted bonding technology

die)黏贴在电路板(pcb)上,并将导线/焊线(wire)直接焊接(bonding)在

proposed to use the fowlp technology (chip-first and die-down


第三架马车:激光辅助键和技术(laser assisted bonding technology
die)黏贴在电路板(pcb)上,并将导线/焊线(wire)直接焊接(bonding)在
proposed to use the fowlp technology (chip-first and die-down