上百种常见的ic封装都在这史上最全
6-smd, no lead (dfn, lcc)
pad是芯片上电路的外接点,lead是lead frame上的连接点.
leadframe for ic package and method of manufacture
背景技术:近几年来,由于qfn封装(quadflatno-leadpackage,方形扁平无
上百种常见的ic封装都在这史上最全
6-smd, no lead (dfn, lcc)
pad是芯片上电路的外接点,lead是lead frame上的连接点.
leadframe for ic package and method of manufacture
背景技术:近几年来,由于qfn封装(quadflatno-leadpackage,方形扁平无