五毛美图【clipbond工艺】包含ball-grid array (bga) and laminate-based csps in that no bond,brewerbond t1100/c1300,tobond clip-in ceiling/mouldproof metal ceiling,来源: chipbond 目前的晶圆级扇出封装,范围从5微米的线宽和间距(5-5等图片的集合。